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Stencil Cleaning Paper in Electronics Manufacturing
The usage of Stencil Cleaning Paper is primarily for manual or semi-automated, on-the-fly cleaning of SMT stencils during PCB assembly—especially in low-to-medium volume production, R&D settings, or as a supplementary cleaning method between automated washes.
Key usages include:
Dry Wiping (Dry Clean):
Used to remove loose solder paste residue, dust, or debris from stencil apertures and surface before or after printing—often with light pressure or a lint-free wiping motion. Ideal for quick touch-ups between prints.
Solvent-Assisted Cleaning (Wet Clean):
Pre-saturated or manually wetted with compatible solvents (e.g., IPA, specialized stencil cleaners), the paper helps dissolve and lift stubborn, dried, or tacky solder paste—particularly effective for fine-pitch or high-viscosity pastes.
Under-Stencil Cleaning (UST):
Some low-lint, high-absorbency stencil cleaning papers are designed for use in under-stencil wipe systems, where the paper moves beneath the stencil during or after printing to capture excess paste and prevent “bleed-out” or smearing.
Non-Abrasive & Non-Scratch Surface Protection:
Engineered to be lint-free, low-residue, and soft—ensuring no damage to delicate electroformed or laser-cut stencils (including nano-coated or nickel-reinforced stencils).
Important Notes:
Not a replacement for full-cycle automated stencil cleaning machines—especially for high-volume, fine-pitch, or lead-free paste applications.
Effectiveness depends on paper quality (fiber composition, absorbency, tensile strength) and proper technique (e.g., single-pass, unidirectional wipe).
Always verify compatibility with your solder paste chemistry and stencil coating to avoid corrosion or coating degradation.
Specification Of Stencil Roll Cleaning Wiper:
Material: 55% Cellulose and 45%
PolyesterGSM(Grammes Per Square Meter):56
Package: Shrink Film/Red ESD Bag
Product Characteristics:
1.Special non-woven fabric construction reduces lint, preventing aperture blockages and contaimination.
2. Absorbent, vacuum friendly and fast wicking
3.Compatible with wide range of print platforms and advanced under stencil cleaners
4.Good for production lines of SMT, Semiconductor, Optic, PCB, Automotive
5.Good tensile strength For Type of Machine:PANASONIC, MPM, DEK, YAMAHA, FUJI, JUKI…ETC
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